本期内容
2020年8/9月刊
封面故事 Cover Story
GaN HEMT: 
更高电压的优势
GaN HEMT: The benefits of far higher voltages
编者话 Editorial
——“超越摩尔定律”领域的宠儿
Compound semiconductor—the favorite of "Beyond Moore's Law"
陆敏
业界动态 Industry
比亚迪半导体又一款芯片导入华为手机充电器
BYD Semiconductor introduces another chip into Huawei system mobile phone charger
长沙三安总投资160亿元第三代半导体项目开工
Changsha San'an's third-generation semiconductor project with a total investment of RMB 16 billion starts
II-VI 公司拟收购两家晶圆半导体公司
II-VI Incorporated to Acquire two semiconductor companies
年产200腔体MOCVD设备!中微公司南昌制造基地开工
200-cavity MOCVD equipment annually! The construction of the Nanchang manufacturing base of AMEC starts
国务院印发《新时期促进集成电路产业和软件产业高质量发展的若干政策》
The State Council issued "Several Policies to Promote the High-quality Development of the Integrated Circuit Industry and Software Industry in the New Era"
泰科天润 高电压产品突破车规级可靠性认证
Global Power Technology's silicon carbide high-voltage products
宽禁带半导体国家工程研究中心专栏 WBS Column
科技前沿 Research Review
技术 Technology
为5G 毫米波设计MMIC
Designing MMICs for millimetre-wave 5G
James Foresi, Luke Smithwick;TRILUMINA 公司
更好晶面的 SiC MOSFET
A better face for the SiC MOSFET
Kosuke Uchida, Takashi Tsuno;住友电工株式会社
用石墨释放SiC功率模块的潜力
Unlocking the potential of SiC power modules with graphite
设计未来的垂直腔面发射激光器 (VCSEL)
Designing tomorrow's VCSELs
九峰山实验室专栏 JFS Laboratory Column
广告索引 Advertisement Index
广告索引
AD Index

 

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