ESI 展示用于LED制造的先进系统

ESI 展示用于LED制造的先进系统

      激光微加工厂商Electro Scientific Industries (ESI) 在Semicon West 2011展出其全系列LED制造系统和应用

      包括多个低成本LED显微机械加工、晶圆雕线及检测先进系统

      The firm is introducing advanced systems for LED micromachining, wafer scribing and testing, which are all designed to deliver the lowest cost of ownership.

      Supplier of laser-based manufacturing solutions for the microtechnology industry, Electro Scientific Industries (ESI) is showcasing its expanded suite of LED manufacturing systems and applications at Semicon West 2011 this week.

      The first of the new systems is the Model 5390 micromachining system for advanced LED packaging. This tool is uniquely designed for creation of electrical interconnections on LED packages and is optimised for industry-leading via placement accuracy and high yields.

      "Our customers are demanding new, innovative manufacturing processes that enable them to enhance light output and product reliability on smaller and smaller LED packages," said Martin Orrick, senior director in ESI's Interconnect and Micromachining Group. "Our Model 5390 enables the industry's fastest and highest via placement accuracy."

      Featuring a high-speed compound beam positioner coupled with a high-power CO2laser, the Model 5390 provides user-definable variable pulse width and pulse repetition frequencies of up to 300 kHz for wide range of applications. The system can produce more than 100 vias per second in typical single layer dielectric materials. The company shipped the first unit to a leading LED manufacturer in the last quarter.